Publication detail

Finite element modelling of the solder connections for the research project A7.11 – Part 2

ŠEVEČEK, O.

English title

Finite element modelling of the solder connections for the research project A7.11 – Part 2

Type

Summary research report

Language

en

Original abstract

Development of the ANSYS postprocessing routines in APDL language for the assessment of the critical locations in the solder joint (taking into account the whole loading history of the solder connection); Preparation of the simulation models for the tensile test of the bi-polar connection with the aim to substitute thermal tests and subsequent design of the suitable boundary conditions for the tensile tests and their verification using FE simulations.

Keywords in English

FE model, solder joint, creep behaviour, tensile test

Released

2013-11-21

Pages count

22

BIBTEX


@misc{BUT106209,
  author="Oldřich {Ševeček}",
  title="Finite element modelling of the solder connections for the research project A7.11 - Part 2",
  year="2013",
  pages="22",
  note="Summary research report"
}