Publication detail

Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method

KARIMI-SIBAKI, E. VAKHRUSHEV, A. WU, M. LUDWIG, A. BOHÁČEK, J. KHARICHA, A.

English title

Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method

Type

WoS Article

Language

en

Original abstract

A numerical model utilizing the volume of fluid (VOF) method is proposed to simulate the transient shape changes of the deposit front, considering the diffusion-limited electrodeposition process. Modeling equations are proposed to accurately handle transport phenomena in both electrolyte (fluid) and deposit (solid). Transient evolutions of field structures, including flow, concentration, electric current density, and electric potential, are computed considering electrodeposited copper bumps. Two cases, including single cavity and multiple cavities, are studied. Based on the modeling results, the maximum height of the hump and the thickness of the deposited layer in each consecutive cavity decreases going from upstream to downstream. Conversely, the location of the maximum height of the hump remains unchanged in all cavities. Results are validated against available experiments.

Keywords in English

SHAPE EVOLUTION; COPPER; DEPOSITION; BUMPS; MODEL

Released

2023-07-04

Publisher

ELECTROCHEMICAL SOC INC

Location

PENNINGTON

ISSN

0013-4651

Journal

Journal of the Electrochemical Society

Volume

170

Number

7

Pages from–to

1–6

Pages count

6

BIBTEX


@article{BUT184760,
  author="Ebrahim {Karimi-Sibaki} and Alexander {Vakhrushev} and Menghuai {Wu} and Andreas {Ludwig} and Jan {Boháček} and Abdellah {Kharicha}",
  title="Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method",
  journal="Journal of the Electrochemical Society",
  year="2023",
  volume="170",
  number="7",
  pages="1--6",
  doi="10.1149/1945-7111/ace133",
  issn="0013-4651",
  url="https://iopscience.iop.org/article/10.1149/1945-7111/ace133"
}