Publication detail
Elimination of self excited oscillations via changes in the thickness of chips.
BŘEZINA, T. VETIŠKA, J.
English title
Elimination of self excited oscillations via changes in the thickness of chips.
Type
Paper in proceedings (conference paper)
Language
en
Original abstract
This paper deals with the possibility of elimination of self-excited oscillations by changing the thickness of chips. These oscillations occur between the tool and machining area during the cutting process without any outer influence. This results into degradation of the machined surface, the geometric accuracy and the noise. A model of cutting process (Eq 1,2) is constructed using the theory of regenerative principle. The model is used to derive analytical formulas for gains of two simple controllers (Fig 2) which control a piezoelectric compensator of the cutting force. The compensator changes the position of cutting tool against the machined surface. This changes the thickness of chips.
Keywords in English
self-excited oscillations, regenerative principle, vibration compensation
Released
2009-11-22
Publisher
Vilnius Gediminas Technical University
Location
Vilnius
ISBN
978-9955-28-493-2
Book
The 5th International Conference Mechatronic Systems and Materials MSM- 2009
Pages from–to
124–126
Pages count
2
BIBTEX
@inproceedings{BUT33818,
author="Tomáš {Březina} and Jan {Vetiška}",
title="Elimination of self excited oscillations via changes in the thickness of chips.",
booktitle="The 5th International Conference Mechatronic Systems and Materials MSM- 2009",
year="2009",
series="1",
number="1",
pages="124--126",
publisher="Vilnius Gediminas Technical University",
address="Vilnius",
isbn="978-9955-28-493-2"
}