Publication detail
Study of Thermal stability of Ultrafine-grained Copper by means of Electron Back Scattering Diffraction
MAN, O. PANTĚLEJEV, L. KUNZ, L.
English title
Study of Thermal stability of Ultrafine-grained Copper by means of Electron Back Scattering Diffraction
Type
Peer-reviewed article not indexed in WoS or Scopus
Language
en
Original abstract
Thermal stability of ultrafine-grained (UFG) structure of 99.9% pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at 180degC in a tube furnace under argon as a covering gas. The dwell times were in the range of 10 min to 120 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the degree of decomposition of the UFG structure. Definition of grain boundaries was based on the misorientation angle of 1. More advanced analysis of the EBSD results based on a kernel average misorientation (KAM) parameter was performed. Inverse pole figure maps with included grain networks did not reveal any substantial changes of UFG microstructure due to annealing. Some shift in the KAM modus in comparison with the initial state was observed but its magnitude was found negligible. Also changes in texture were found to be minor. On the other hand the microhardness increases with increasing time of annealing.
Keywords in English
ultra-fine grained copper, thermal stability of microstructure, EBSD, grain size, texture
Released
2010-01-25
Publisher
The Japan Institute of Metals
Location
Japonsko
ISSN
1345-9678
Journal
MATERIALS TRANSACTIONS
Volume
51
Number
2
Pages from–to
209–213
Pages count
5
BIBTEX
@article{BUT48360,
author="Ondřej {Man} and Libor {Pantělejev} and Ludvík {Kunz}",
title="Study of Thermal stability of Ultrafine-grained Copper by means of Electron Back Scattering Diffraction",
journal="MATERIALS TRANSACTIONS",
year="2010",
volume="51",
number="2",
pages="209--213",
issn="1345-9678"
}