Publication detail

MECHANICAL PROPERTIES AND MICROSTRUCTURE OF MODEL LEAD-FREE JOINTS FOR ELECTRONICS MADE WITH USE OF NANOPOWDERS

BURŠÍK, J. BURŠÍKOVÁ, V. PEŠINA, Z. SOPOUŠEK, J.

English title

MECHANICAL PROPERTIES AND MICROSTRUCTURE OF MODEL LEAD-FREE JOINTS FOR ELECTRONICS MADE WITH USE OF NANOPOWDERS

Type

Peer-reviewed article not indexed in WoS or Scopus

Language

en

Original abstract

Ag nanopowders were prepared as potential low-toxic constituents of novel solders by a chemical wet synthesis. Resulting nanoparticles were characterized using a transmission electron microscope. Model joints, i.e. sandwiches consisting of thin copper plates with Ag nanopowder interlayer were prepared and annealed at various temperatures. Metallographic cross-sections were studied using a scanning electron microscope. The main emphasis was placed on the characterization of sintered Ag layers on crosssections by means of nanoindentation experiments. Microhardness and other mechanical properties of sintered Ag layers were measured by instrumented indentation with Berkovich indenter. Both the mechanical properties and the observed microstructure were compared with our previous results obtained on similar materials.

Keywords in English

Ag nano, low sintering process, microhardness

Released

2012-09-06

ISSN

0009-2770

Volume

1

Number

106

Pages from–to

390–392

Pages count

3

BIBTEX


@article{BUT94883,
  author="Jiří {Buršík} and Vilma {Buršíková} and Zbyněk {Pešina} and Jiří {Sopoušek}",
  title="MECHANICAL PROPERTIES AND MICROSTRUCTURE OF MODEL LEAD-FREE JOINTS FOR ELECTRONICS MADE WITH USE OF NANOPOWDERS",
  journal="CHEMICKE LISTY",
  year="2012",
  volume="1",
  number="106",
  pages="390--392",
  issn="0009-2770"
}