Publication detail

Criterion for crack kinking out of the interface of two orthotropic layers subjected to thermal and mechanical loading

DAMBORSKÝ, P. ŠEVEČEK, O. PROFANT, T. KOTOUL, M.

English title

Criterion for crack kinking out of the interface of two orthotropic layers subjected to thermal and mechanical loading

Type

Paper in proceedings (conference paper)

Language

en

Original abstract

The problem of crack path stability along the interface between two orthotropic elastically dissimilar materials under the presence of in-plane residual stresses is analyzed using the concept of Finite Fracture Mechanics and matched asymptotic procedure. An energy based fracture criterion is introduced for this problem and it is investigated whether and how is the criterion for the prediction of crack kinking from the interface affected by residual stresses. The complex stress intensity factor and the T-stress characterizing the stress state at the crack tip are calculated both for the thermal (residual stresses) and mechanical loading using the two-state integral. The matched asymptotic procedure together with FEM is used to derive the change of the potential energy induced by the crack growth by crack increment of finite length.

Keywords in English

Interface crack, Finite Fracture Mechanics, Crack Propagation, Fracture Criterion, FEM

Released

2014-01-06

Publisher

Trans Tech Publications

Location

Švýcarsko

ISBN

978-3-03785-934-6

ISSN

1013-9826

Book

Materials Structure and Micromechanics of Fracture VII

Journal

Key Engineering Materials (print)

Volume

592-593

Number

1

Pages from–to

169–172

Pages count

4

BIBTEX


@inproceedings{BUT101181,
  author="Petr {Damborský} and Oldřich {Ševeček} and Tomáš {Profant} and Michal {Kotoul}",
  title="Criterion for crack kinking out of the interface of two orthotropic layers subjected to thermal and mechanical loading",
  booktitle="Materials Structure and Micromechanics of Fracture VII",
  year="2014",
  journal="Key Engineering Materials (print)",
  volume="592-593",
  number="1",
  pages="169--172",
  publisher="Trans Tech Publications",
  address="Švýcarsko",
  doi="10.4028/www.scientific.net/KEM.592-593.169",
  isbn="978-3-03785-934-6",
  issn="1013-9826"
}