Detail publikace

Criterion for crack kinking out of the interface of two orthotropic layers subjected to thermal and mechanical loading

DAMBORSKÝ, P. ŠEVEČEK, O. PROFANT, T. KOTOUL, M.

Anglický název

Criterion for crack kinking out of the interface of two orthotropic layers subjected to thermal and mechanical loading

Typ

Stať ve sborníku v databázi WoS či Scopus

Jazyk

en

Originální abstrakt

The problem of crack path stability along the interface between two orthotropic elastically dissimilar materials under the presence of in-plane residual stresses is analyzed using the concept of Finite Fracture Mechanics and matched asymptotic procedure. An energy based fracture criterion is introduced for this problem and it is investigated whether and how is the criterion for the prediction of crack kinking from the interface affected by residual stresses. The complex stress intensity factor and the T-stress characterizing the stress state at the crack tip are calculated both for the thermal (residual stresses) and mechanical loading using the two-state integral. The matched asymptotic procedure together with FEM is used to derive the change of the potential energy induced by the crack growth by crack increment of finite length.

Klíčová slova anglicky

Interface crack, Finite Fracture Mechanics, Crack Propagation, Fracture Criterion, FEM

Vydáno

2014-01-06

Nakladatel

Trans Tech Publications

Místo

Švýcarsko

ISBN

978-3-03785-934-6

ISSN

1013-9826

Kniha

Materials Structure and Micromechanics of Fracture VII

Časopis

Key Engineering Materials (print)

Ročník

592-593

Číslo

1

Strany od–do

169–172

Počet stran

4

BIBTEX


@inproceedings{BUT101181,
  author="Petr {Damborský} and Oldřich {Ševeček} and Tomáš {Profant} and Michal {Kotoul}",
  title="Criterion for crack kinking out of the interface of two orthotropic layers subjected to thermal and mechanical loading",
  booktitle="Materials Structure and Micromechanics of Fracture VII",
  year="2014",
  journal="Key Engineering Materials (print)",
  volume="592-593",
  number="1",
  pages="169--172",
  publisher="Trans Tech Publications",
  address="Švýcarsko",
  doi="10.4028/www.scientific.net/KEM.592-593.169",
  isbn="978-3-03785-934-6",
  issn="1013-9826"
}