Publication detail
Coupled Thermal-Structural Transient Analysis of Pressure Sensors
VLACH, R.
English title
Coupled Thermal-Structural Transient Analysis of Pressure Sensors
Type
Paper in proceedings (conference paper)
Language
en
Original abstract
This paper describes computational simulation of coupled analysis of pressure sensors during passage through the furnace. This analysis should show residual stress that is the problem for the next operation as pressure sensor. The software ANSYS/Workbanch was used for coupled thermal-stress analyses. The goal of the project is determination if the residual stress cause by temperature rise in the furnace has a significant impact on pressure sensor accuracy.
Keywords in English
thermal stress analysis, senzors
Released
2013-10-07
ISBN
978-3-319-02293-2
Book
Mechatronics 2013
Pages from–to
495–501
Pages count
7
BIBTEX
@inproceedings{BUT104973,
author="Radek {Vlach}",
title="Coupled Thermal-Structural Transient Analysis of Pressure Sensors",
booktitle="Mechatronics 2013",
year="2013",
pages="495--501",
isbn="978-3-319-02293-2"
}