Detail publikace

Coupled Thermal-Structural Transient Analysis of Pressure Sensors

VLACH, R.

Anglický název

Coupled Thermal-Structural Transient Analysis of Pressure Sensors

Typ

Stať ve sborníku v databázi WoS či Scopus

Jazyk

en

Originální abstrakt

This paper describes computational simulation of coupled analysis of pressure sensors during passage through the furnace. This analysis should show residual stress that is the problem for the next operation as pressure sensor. The software ANSYS/Workbanch was used for coupled thermal-stress analyses. The goal of the project is determination if the residual stress cause by temperature rise in the furnace has a significant impact on pressure sensor accuracy.

Klíčová slova anglicky

thermal stress analysis, senzors

Vydáno

2013-10-07

ISBN

978-3-319-02293-2

Kniha

Mechatronics 2013

Strany od–do

495–501

Počet stran

7

BIBTEX


@inproceedings{BUT104973,
  author="Radek {Vlach}",
  title="Coupled Thermal-Structural Transient Analysis of Pressure Sensors",
  booktitle="Mechatronics 2013",
  year="2013",
  pages="495--501",
  isbn="978-3-319-02293-2"
}