Publication detail

Influence of Low Temperature on Fatigue Behaviour of UFG Copper Prepared by ECAP

BUKSA, M.

English title

Influence of Low Temperature on Fatigue Behaviour of UFG Copper Prepared by ECAP

Type

Paper in proceedings (conference paper)

Language

en

Original abstract

Fatigue behaviour of ultrafine-grained copper of 99.9% purity, produced by equal channel angular pressing (ECAP) was determined under stress control and room temperature and at a temperature of 173 K. The obtained experimental data was compared to the corresponding data of conventional-grain copper.

Keywords in English

Fatigue behaviour; ECAP; Ultrafine-grained structure; Temperature sensitivity; Copper

Released

2006-11-30

Publisher

Ústav fyziky materiálů AV ČR

Location

Brno

ISBN

80-239-8271-0

Book

Víceúrovňový design pokrokových materiálů 2006

Pages from–to

109–118

Pages count

10

BIBTEX


@inproceedings{BUT21734,
  author="Michal {Buksa}",
  title="Influence of Low Temperature on Fatigue Behaviour of UFG Copper Prepared by ECAP",
  booktitle="Víceúrovňový design pokrokových materiálů 2006",
  year="2006",
  pages="109--118",
  publisher="Ústav fyziky materiálů AV ČR",
  address="Brno",
  isbn="80-239-8271-0"
}