Publication detail

Influence of Purity and Route of ECAP Process on Fatigue Behaviour of UFG Copper

BUKSA, M. KUNZ, L. WANG, Q.

English title

Influence of Purity and Route of ECAP Process on Fatigue Behaviour of UFG Copper

Type

Paper in proceedings (conference paper)

Language

en

Original abstract

It has been indicated in literature that the reason for different fatigue lifetime of UFG materials should be sought in the details of the ECAP process, purity and microstructure stability. The aim of this study is to contribute to deeper understanding of the influence of details of the ECAP process and material purity on fatigue strength of UFG Cu.

Keywords in English

ECAP process, fatigue lifetime, UFG Cu, influence of details, purity

Released

2007-06-25

Publisher

Žilinská univerzita

Location

Žilina

ISBN

978-80-8070-695-1

Book

Transcom 2007

Pages from–to

49–52

Pages count

4

BIBTEX


@inproceedings{BUT28970,
  author="Michal {Buksa} and Ludvík {Kunz} and Qingjuan {Wang}",
  title="Influence of Purity and Route of ECAP Process on Fatigue Behaviour of UFG Copper",
  booktitle="Transcom 2007",
  year="2007",
  pages="49--52",
  publisher="Žilinská univerzita",
  address="Žilina",
  isbn="978-80-8070-695-1"
}