Detail publikace
Influence of Purity and Route of ECAP Process on Fatigue Behaviour of UFG Copper
BUKSA, M. KUNZ, L. WANG, Q.
Anglický název
Influence of Purity and Route of ECAP Process on Fatigue Behaviour of UFG Copper
Typ
Stať ve sborníku v databázi WoS či Scopus
Jazyk
en
Originální abstrakt
It has been indicated in literature that the reason for different fatigue lifetime of UFG materials should be sought in the details of the ECAP process, purity and microstructure stability. The aim of this study is to contribute to deeper understanding of the influence of details of the ECAP process and material purity on fatigue strength of UFG Cu.
Klíčová slova anglicky
ECAP process, fatigue lifetime, UFG Cu, influence of details, purity
Vydáno
2007-06-25
Nakladatel
Žilinská univerzita
Místo
Žilina
ISBN
978-80-8070-695-1
Kniha
Transcom 2007
Strany od–do
49–52
Počet stran
4
BIBTEX
@inproceedings{BUT28970,
author="Michal {Buksa} and Ludvík {Kunz} and Qingjuan {Wang}",
title="Influence of Purity and Route of ECAP Process on Fatigue Behaviour of UFG Copper",
booktitle="Transcom 2007",
year="2007",
pages="49--52",
publisher="Žilinská univerzita",
address="Žilina",
isbn="978-80-8070-695-1"
}