Publication detail
Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition
NAVRÁTILOVÁ, L. PANTĚLEJEV, L. MAN, O. KUNZ, L.
English title
Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition
Type
Paper in proceedings (conference paper)
Language
en
Original abstract
The objective of the present work was to study the stability of microstructure of ultra fine-grained (UFG) copper under high-cycle and very high-cycle fatigue loading and under thermal exposition. UFG Cu was prepared by equal channel angular pressing. No grain coarsening was observed after fatigue resulting in failure in the interval from 104 to 1010 cycles. Similarly, no grain coarsening was detected after thermal exposition at a temperature of 180 C for 6 min. The microstructure was examined by electron backscattering diffraction (EBSD) and transmission electron microscopy (TEM)
Keywords in English
UFG copper, ECAP, stability of microstructure, EBSD
Released
2009-06-22
Publisher
University of Žilina
Location
Žilina, Sk
ISBN
978-80-554-0042-6
Book
Proceedings Transcom 2009
Pages from–to
149–154
Pages count
6
BIBTEX
@inproceedings{BUT33240,
author="Lucie {Navrátilová} and Libor {Pantělejev} and Ondřej {Man} and Ludvík {Kunz}",
title="Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition",
booktitle="Proceedings Transcom 2009",
year="2009",
series="Section 5",
number="1",
pages="149--154",
publisher="University of Žilina",
address="Žilina, Sk",
isbn="978-80-554-0042-6"
}