Detail publikace
Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition
NAVRÁTILOVÁ, L. PANTĚLEJEV, L. MAN, O. KUNZ, L.
Anglický název
Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition
Typ
Stať ve sborníku v databázi WoS či Scopus
Jazyk
en
Originální abstrakt
The objective of the present work was to study the stability of microstructure of ultra fine-grained (UFG) copper under high-cycle and very high-cycle fatigue loading and under thermal exposition. UFG Cu was prepared by equal channel angular pressing. No grain coarsening was observed after fatigue resulting in failure in the interval from 104 to 1010 cycles. Similarly, no grain coarsening was detected after thermal exposition at a temperature of 180 C for 6 min. The microstructure was examined by electron backscattering diffraction (EBSD) and transmission electron microscopy (TEM)
Klíčová slova anglicky
UFG copper, ECAP, stability of microstructure, EBSD
Vydáno
2009-06-22
Nakladatel
University of Žilina
Místo
Žilina, Sk
ISBN
978-80-554-0042-6
Kniha
Proceedings Transcom 2009
Strany od–do
149–154
Počet stran
6
BIBTEX
@inproceedings{BUT33240,
author="Lucie {Navrátilová} and Libor {Pantělejev} and Ondřej {Man} and Ludvík {Kunz}",
title="Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition",
booktitle="Proceedings Transcom 2009",
year="2009",
series="Section 5",
number="1",
pages="149--154",
publisher="University of Žilina",
address="Žilina, Sk",
isbn="978-80-554-0042-6"
}