Publication detail

MSM System in Package - One Way to System Integration

SZENDIUCH, I.

Czech title

MSM - Cesta k systémové integraci

English title

MSM System in Package - One Way to System Integration

Type

conference paper

Language

en

Original abstract

The stacked packages are one of the most significant advances for building modern electronic systems. They give a good oportunity to built a high volume 3D devices with requested quality.

Czech abstract

Vrstvená pouzdra představují jednu z moderních možností konstrukce elektronických systémů. Umožňují konstruovat zařízení 3D s vysokou integrací i jakostí.

English abstract

The stacked packages are one of the most significant advances for building modern electronic systems. They give a good oportunity to built a high volume 3D devices with requested quality.

Keywords in Czech

MSM, SOC, CSP, SIP

Keywords in English

MSM, SOC, CSP, SIP

Released

01.05.2002

Publisher

TYPOS-Digital Print

Location

Praha

ISBN

0-7803-9824-6

Book

ISSE 2002

Edition number

1

Pages count

3

BIBTEX


@inproceedings{BUT4778,
  author="Ivan {Szendiuch},
  title="MSM System in Package – One Way to System Integration",
  booktitle="ISSE 2002",
  year="2002",
  month="May",
  publisher="TYPOS-Digital Print",
  address="Praha",
  isbn="0-7803-9824-6"
}