Publication detail

Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition

KUNZ, L. LUKÁŠ, P. PANTĚLEJEV, L. MAN, O.

English title

Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition

Type

Peer-reviewed article not indexed in WoS or Scopus

Language

en

Original abstract

Effect of cyclic loading and thermal exposition on microstructure of bulk ultrafinegrained Cu prepared by equal channel angular pressing was experimentally investigated by means of electron backscattering diffraction and by transmission electron microscopy. Stability of the microstructure under stress-controlled cyclic loading with a tensile mean stress of 200 MPa was shown to be high. Neither dynamic grain coarsening nor development of bimodal microstructure was observed. However, annealing at 250 C for 30 min resulted in formation of bimodal microstructure. Consequently, fatigue strength of annealed specimens was low.

Keywords in English

equal channel angular pressing, fatigue, stability of microstructure, ultrafine-grained copper

Released

2011-12-01

Publisher

Blackwell Publishing Ltd

Location

New Delhi

ISSN

0039-2103

Journal

STRAIN

Volume

47

Number

6

Pages from–to

476–482

Pages count

7

BIBTEX


@article{BUT48103,
  author="Ludvík {Kunz} and Petr {Lukáš} and Libor {Pantělejev} and Ondřej {Man}",
  title="Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition",
  journal="STRAIN",
  year="2011",
  volume="47",
  number="6",
  pages="476--482",
  issn="0039-2103"
}