Detail publikace

Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition

KUNZ, L. LUKÁŠ, P. PANTĚLEJEV, L. MAN, O.

Anglický název

Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition

Typ

Článek recenzovaný mimo WoS a Scopus

Jazyk

en

Originální abstrakt

Effect of cyclic loading and thermal exposition on microstructure of bulk ultrafinegrained Cu prepared by equal channel angular pressing was experimentally investigated by means of electron backscattering diffraction and by transmission electron microscopy. Stability of the microstructure under stress-controlled cyclic loading with a tensile mean stress of 200 MPa was shown to be high. Neither dynamic grain coarsening nor development of bimodal microstructure was observed. However, annealing at 250 C for 30 min resulted in formation of bimodal microstructure. Consequently, fatigue strength of annealed specimens was low.

Klíčová slova anglicky

equal channel angular pressing, fatigue, stability of microstructure, ultrafine-grained copper

Vydáno

2011-12-01

Nakladatel

Blackwell Publishing Ltd

Místo

New Delhi

ISSN

0039-2103

Ročník

47

Číslo

6

Strany od–do

476–482

Počet stran

7

BIBTEX


@article{BUT48103,
  author="Ludvík {Kunz} and Petr {Lukáš} and Libor {Pantělejev} and Ondřej {Man}",
  title="Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition",
  journal="STRAIN",
  year="2011",
  volume="47",
  number="6",
  pages="476--482",
  issn="0039-2103"
}