Publication detail

Grain Contrast Imaging in UHV SLEEM

MIKMEKOVÁ, Š. HOVORKA, M. MÜLLEROVÁ, I. MAN, O. PANTĚLEJEV, L. FRANK, L.

English title

Grain Contrast Imaging in UHV SLEEM

Type

Peer-reviewed article not indexed in WoS or Scopus

Language

en

Original abstract

Study of the grain structure in the equal channel angular pressing processed copper by means of the cathode lens equipped ultrahigh vacuum scanning low energy electron microscope is reported. The grain contrast was found achieving its maximum at electron energies below about 30 eV where it alternated its sign and exhibited dependence on electron energy specific for the grain orientation. The energy dependence of the electron reflectance seemed to be capable of serving as a fingerprint enabling determination of the crystalline orientation. In the cathode lens mode at hundreds of eV fine details of the microstructure are also observable including twins and low angle grain boundaries. This is explained by acquisition of high-angle backscattered slow electrons, normally not acquired in standard scanning electron microscopes. The very low energy electron reflectance is promising as an alternative to the EBSD method owing to its high resolution and fast data acquisition.

Keywords in English

scanning low energy electron microscopy, electron backscatter diffraction (EBSD), grain contrast, ultra-fine grained materials

Released

2010-01-25

Publisher

The Japan Institute of Metals

Location

Ichibancho, Aoba-ku, Sendai 980-8544, Japan

ISSN

1345-9678

Journal

MATERIALS TRANSACTIONS

Volume

51

Number

2

Pages from–to

292–296

Pages count

5

BIBTEX


@article{BUT48741,
  author="Šárka {Mikmeková} and Miloš {Hovorka} and Ilona {Müllerová} and Ondřej {Man} and Libor {Pantělejev} and Luděk {Frank}",
  title="Grain Contrast Imaging in UHV SLEEM",
  journal="MATERIALS TRANSACTIONS",
  year="2010",
  volume="51",
  number="2",
  pages="292--296",
  issn="1345-9678"
}