Publication detail

Hardware for Physics - on failure Based Accelerated Stress Testing of Solder Joint

HUB, P. ŠANDERA, J.

English title

Hardware for Physics - on failure Based Accelerated Stress Testing of Solder Joint

Type

conference paper

Language

en

Original abstract

This article describes advanced thermomechanical accelerated testing technique of solder joint reliability.

English abstract

This article describes advanced thermomechanical accelerated testing technique of solder joint reliability.

Keywords in English

accelerated testing, thermomechanical tests, solder joint, heating element, cooling water, thermal cycle, camera, timer, temperature capacity, thermocouple, temperature profil

RIV year

2003

Released

09.09.2003

Publisher

Vysoké učení technické v Brně, Antonínská 1

Location

Brno

ISBN

80-214-2452-4

Book

10th Electronic Devices and Systems Conference 2003

Volume

2003

Number

1

Edition number

1

Pages count

4

BIBTEX


@inproceedings{BUT9231,
  author="Petr {Hub} and Josef {Šandera},
  title="Hardware for Physics – on failure Based Accelerated Stress Testing of Solder Joint",
  booktitle="10th Electronic Devices and Systems Conference 2003",
  year="2003",
  volume="2003",
  number="1",
  month="September",
  publisher="Vysoké učení technické v Brně, Antonínská 1",
  address="Brno",
  isbn="80-214-2452-4"
}