Detail publikace

Hardware for Physics – on failure Based Accelerated Stress Testing of Solder Joint

HUB, P. ŠANDERA, J.

Anglický název

Hardware for Physics - on failure Based Accelerated Stress Testing of Solder Joint

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

en

Originální abstrakt

This article describes advanced thermomechanical accelerated testing technique of solder joint reliability.

Anglický abstrakt

This article describes advanced thermomechanical accelerated testing technique of solder joint reliability.

Klíčová slova anglicky

accelerated testing, thermomechanical tests, solder joint, heating element, cooling water, thermal cycle, camera, timer, temperature capacity, thermocouple, temperature profil

Rok RIV

2003

Vydáno

09.09.2003

Nakladatel

Vysoké učení technické v Brně, Antonínská 1

Místo

Brno

ISBN

80-214-2452-4

Kniha

10th Electronic Devices and Systems Conference 2003

Ročník

2003

Číslo

1

Číslo edice

1

Počet stran

4

BIBTEX


@inproceedings{BUT9231,
  author="Petr {Hub} and Josef {Šandera},
  title="Hardware for Physics – on failure Based Accelerated Stress Testing of Solder Joint",
  booktitle="10th Electronic Devices and Systems Conference 2003",
  year="2003",
  volume="2003",
  number="1",
  month="September",
  publisher="Vysoké učení technické v Brně, Antonínská 1",
  address="Brno",
  isbn="80-214-2452-4"
}