Detail publikace
Influence of the T-stress on the crack bifurcation phenomenon in ceramic laminates
ŠEVEČEK, O. BERMEJO, R. PROFANT, T. KOTOUL, M.
Anglický název
Influence of the T-stress on the crack bifurcation phenomenon in ceramic laminates
Typ
Stať ve sborníku v databázi WoS či Scopus
Jazyk
en
Originální abstrakt
The influence of the compressive residual stresses and layer thickness in ceramic laminates on the presence of the crack bifurcation phenomenon is numerically investigated in this contribution. Using the fracture criterion, based on the Finite Fracture Mechanics, the angle and type of crack propagation (single crack deflection/bifurcation) within the layers with large compressive stresses is investigated. Laminates with various thicknesses of the compressive layer and constant level of the compressive residual stresses are used for this purpose. In these cases, the level of the T-stress (in the vicinity of the crack tip) can play a role as a second parameter in the fracture criterion (next to the stress intensity factor) and as a consequence can this term influence the predicted crack propagation behaviour.
Klíčová slova anglicky
Ceramic laminates;T-stress; crack bifurcation; Finite Fracture Mechanics
Vydáno
2014-07-01
Nakladatel
Elsevier
Místo
Trondheim, Norsko
ISBN
9781632669094
ISSN
2211-8128
Kniha
20th European Conference on Fracture (ECF 2014)
Časopis
Procedia Materials Science
Ročník
3
Číslo
7
Strany od–do
1062–1067
Počet stran
6
BIBTEX
@inproceedings{BUT108414,
author="Oldřich {Ševeček} and Raul {Bermejo} and Tomáš {Profant} and Michal {Kotoul}",
title="Influence of the T-stress on the crack bifurcation phenomenon in ceramic laminates",
booktitle="20th European Conference on Fracture (ECF 2014)",
year="2014",
series="Procedia Materials Science Volume 3",
journal="Procedia Materials Science",
volume="3",
number="7",
pages="1062--1067",
publisher="Elsevier",
address="Trondheim, Norsko",
doi="10.1016/j.mspro.2014.06.173",
isbn="9781632669094",
issn="2211-8128"
}