Detail publikace

FE modelling and analysis of the solder connections for the research project A7.11

ŠEVEČEK, O.

Anglický název

FE modelling and analysis of the solder connections for the research project A7.11

Typ

Souhrnná výzkumná zpráva

Jazyk

en

Originální abstrakt

FE simulations of the solder connections of electronic parts under different operating and testing boundary conditions (tensile and thermal tests); Investigations of the the critical regions in the solder joint where potential final failure of the joint can occur and subsequent comparision of the simulation results with experimental observations.

Klíčová slova anglicky

FE model; solder joint; creep behaviour; tensile test

Vydáno

2014-08-20

Počet stran

19

BIBTEX


@misc{BUT113398,
  author="Oldřich {Ševeček}",
  title="FE modelling and analysis of the solder connections for the research project A7.11",
  year="2014",
  pages="19",
  note="Summary research report"
}