Detail publikace
The Role of Residual Stresses in Particulate Composite with Glass Matrix
MAJER, Z. NÁHLÍK, L. HUTAŘ, P.
Anglický název
The Role of Residual Stresses in Particulate Composite with Glass Matrix
Typ
Článek Scopus
Jazyk
en
Originální abstrakt
The particulate composites with glass matrix are widely used in many engineering applications. The mismatch of coefficients of thermal expansion during the fabrication process usually causes the presence of the residual stresses around particles. The influence and the understanding of the effects of residual stresses on the material response is required. The main aim of the present paper was to create a two-dimensional finite element model to analyze the influence of residual stresses on micro-crack behavior of glass and ceramics-based particulate composites. The maximum tangential stress criterion (MTS) was used to predict the direction of the micro-crack propagation. The modelled material was a kind of Low Temperature Co-fired Ceramics (LTCC) containing alumina particles embedded in a glass matrix. The influence of the micro-crack length and magnitude of loading on the micro-crack propagation path were investigated. The finite element software ANSYS was used. Conclusions of this paper can contribute to a better understanding of the propagation of micro-cracks in particulate composites in the field of residual stresses.
Klíčová slova anglicky
Ceramic, Crack Propagation, Crack Retardation, Particulate Composite, Residual Stresses
Vydáno
2016-01-04
Nakladatel
Trans Tech Publications Ltd
Místo
Switzerland
ISSN
1013-9826
Časopis
Key Engineering Materials (print)
Ročník
665
Číslo
1
Strany od–do
173–176
Počet stran
4
BIBTEX
@article{BUT117311,
author="Zdeněk {Majer} and Luboš {Náhlík} and Pavel {Hutař}",
title="The Role of Residual Stresses in Particulate Composite with Glass Matrix",
journal="Key Engineering Materials (print)",
year="2016",
volume="665",
number="1",
pages="173--176",
doi="10.4028/www.scientific.net/KEM.665.173",
issn="1013-9826",
url="http://www.scientific.net/KEM.665.173"
}