Detail publikace

Dimensionally Stable Laminates Under Thermal Loading and Their Applications

SYMONOV, V.

Anglický název

Dimensionally Stable Laminates Under Thermal Loading and Their Applications

Typ

Článek recenzovaný mimo WoS a Scopus

Jazyk

en

Originální abstrakt

There exist many types of structures, which are required to have stable dimensions within a wide range of temperatures. The specific nature of composites allows finding special conditions when a laminate stacking sequence can provide zero thermal expansion coefficients in one or more directions. This allows the structure being designed to have the same dimensions in a wide range of temperatures. This work is aimed to find mathematical conditions, which guarantee in-plane zero CTE at least in one direction. As an application of thermally stable laminates a rotating disk is chosen. The mathematical model for such a disk is presented. Among investigated materials there was not found any of them, which can be used to layup a laminate with zero CTEs in two directions. However, all investigated materials can be used to layup many laminates with zero CTE in one or another direction. Moreover, it was discovered a laminate might have a zero CTE, if the lamina has zero or negative CTE at least in one direction. It was found the stresses, which appear in a laminated disk caused by centripetal forces, are insignificantly low in comparison to the thermal ones within the investigated ranges of angular velocity and temperature.

Klíčová slova anglicky

Dimentionally stable laminates, thermal loading, zero CTE, thermostable disks

Vydáno

2019-12-17

Nakladatel

EDP Sciences

ISBN

eISSN: 2261-236X

ISSN

2261-236X

Kniha

MATEC Web Conferences

Časopis

MATEC web of conferences

Ročník

2019

Číslo

304

Strany od–do

1–10

Počet stran

10

BIBTEX


@article{BUT160947,
  author="Volodymyr {Symonov}",
  title="Dimensionally Stable Laminates Under Thermal Loading and Their Applications",
  journal="MATEC web of conferences",
  year="2019",
  volume="2019",
  number="304",
  pages="1--10",
  doi="10.1051/matecconf/201930401001",
  issn="2274-7214",
  url="https://www.matec-conferences.org/articles/matecconf/pdf/2019/53/matecconf_easn2019_01001.pdf"
}