Detail publikace
Microstructural evolution and formation of extended voids in Ag-Cu metal-matrix composite during prolonged annealing
STRAKOŠOVÁ, A. DVORSKÝ, D. MOLNÁROVÁ, O. KOLÍBAL, M. DUCHOŇ, J. SVORA, P. PRŮŠA, F. LEJČEK, P.
Anglický název
Microstructural evolution and formation of extended voids in Ag-Cu metal-matrix composite during prolonged annealing
Typ
Článek WoS
Jazyk
en
Originální abstrakt
Prolonged annealing of Ag-Cu metastable metal-matrix composite produced by compaction of Cu@Ag core-shell powder, revealed dramatic transformations in its microstructure. Heat treatment resulted in pronounced changes in particle morphology, extended grain boundary diffusion, and the formation of surface pores at the Cu/Ag interface, as well as extended voids within the bulk material. These phenomena are interpreted as consequences of the reduction of surface, interface and grain boundary energy, and diffusion and wetting processes, including pore migration and coagulation. Based on experimental observations, a model has been developed that explains the growth and migration of the pores leading to the formation of extended voids. This study provides new insight into the mechanisms of microstructural evolution in metal-matrix composites when annealed at relatively high temperatures, and opens pathways for their targeted application in advanced technologies such as electronic contacts.
Klíčová slova anglicky
Metal-matrix composite, Ag-Cu, Annealing, Shape changes, Diffusion, Voids formation
Vydáno
2026-04-05
Nakladatel
Elsevier
Časopis
Journal of Alloys and Compounds
Ročník
1061
Číslo
1
Strany od–do
1–10
Počet stran
10
BIBTEX
@article{BUT201873,
author="{} and {} and {} and Miroslav {Kolíbal} and {} and {} and {} and {}",
title="Microstructural evolution and formation of extended voids in Ag-Cu metal-matrix composite during prolonged annealing",
journal="Journal of Alloys and Compounds",
year="2026",
volume="1061",
number="1",
pages="1--10",
doi="10.1016/j.jallcom.2026.187418",
issn="0925-8388",
url="https://www.sciencedirect.com/science/article/pii/S0925838826014866"
}