Detail publikace

Study of stress distribution around an orthotropic bi-material notch tip

KLUSÁK, J. PROFANT, T. KOTOUL, M.

Anglický název

Study of stress distribution around an orthotropic bi-material notch tip

Typ

Článek recenzovaný mimo WoS a Scopus

Jazyk

en

Originální abstrakt

The analysis addresses a typical failure development pattern in thin films consisting of a system of multiple surface cracks leading to and branching along or near the interface between the film and the base material. The process is driven by thermal residual stresses and/or mechanical loading.

Klíčová slova anglicky

Genaral stress singularities, composite materials, orthotropic bi-material notch

Vydáno

2009-07-14

Nakladatel

Trans Tech Publications Ltd.

Místo

Holandsko

ISSN

1013-9826

Časopis

Key Engineering Materials (print)

Ročník

417-418

Číslo

1

Strany od–do

385–388

Počet stran

4

BIBTEX


@article{BUT47568,
  author="Jan {Klusák} and Tomáš {Profant} and Michal {Kotoul}",
  title="Study of stress distribution around an orthotropic bi-material notch tip",
  journal="Key Engineering Materials (print)",
  year="2009",
  volume="417-418",
  number="1",
  pages="385--388",
  issn="1013-9826"
}