Detail publikace
Effect of Annealing on Microstructure and Fatigue Life of UFG Copper
NAVRÁTILOVÁ, L. KUNZ, L. MAN, O. PANTĚLEJEV, L.
Anglický název
Effect of Annealing on Microstructure and Fatigue Life of UFG Copper
Typ
Článek recenzovaný mimo WoS a Scopus
Jazyk
en
Originální abstrakt
The influence of annealing of ultrafine-grained copper prepared by equal channel angular pressing on its fatigue life was experimentally determined. The fatigue loading was carried out with tensile mean stress of 200 MPa. The microstructure was examined by means of transmission electron microscopy and by means of electron back scattering diffraction. Annealing was found to result in development of bimodal microstructure. The fatigue performance of this structure is worth than that of original ultrafine-grained structure.
Klíčová slova anglicky
UFG copper, ECAP, annealing, fatigue behaviour, mean stress
Vydáno
2009-07-13
Nakladatel
University of Žilina
Místo
Žilina
ISSN
1335-0803
Časopis
Materiálové inžinierstvo
Ročník
XVI
Číslo
3a
Strany od–do
28–31
Počet stran
4
BIBTEX
@article{BUT49173,
author="Lucie {Navrátilová} and Ludvík {Kunz} and Ondřej {Man} and Libor {Pantělejev}",
title="Effect of Annealing on Microstructure and Fatigue Life of UFG Copper",
journal="Materiálové inžinierstvo",
year="2009",
volume="XVI",
number="3a",
pages="28--31",
issn="1335-0803"
}