Detail publikace

Influence of the CTE on Mechanical Stress of Chip SMD Components

ŠANDERA, J. HEJÁTKOVÁ, E.

Anglický název

Influence of the CTE on Mechanical Stress of Chip SMD Components

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

en

Originální abstrakt

This paper describes the reasons of mechanical stress of SMD chip components soldered on FR4 substrate caused by thermal changes on board. There is especially presented a simulation of mechanical stress in volume ceramic capacitor body in 1206 package. Simulation ANSYS program for finite element analysis and design is used.

Anglický abstrakt

This paper describes the reasons of mechanical stress of SMD chip components soldered on FR4 substrate caused by thermal changes on board. There is especially presented a simulation of mechanical stress in volume ceramic capacitor body in 1206 package. Simulation ANSYS program for finite element analysis and design is used.

Klíčová slova anglicky

SMT, Chip Component, Coefficient of Thermal Expansion, Effective Stress, ANSYS simulation software, 1206 chip component

Rok RIV

2002

Vydáno

01.01.2002

Místo

Brno

ISBN

80-214-2217-3

Kniha

Socrates Workshop 2002 - Proceedings

Číslo edice

1.

Počet stran

5

BIBTEX


@inproceedings{BUT5119,
  author="Josef {Šandera} and Edita {Hejátková},
  title="Influence of the CTE on Mechanical Stress of Chip SMD Components",
  booktitle="Socrates Workshop 2002 - Proceedings",
  year="2002",
  month="January",
  address="Brno",
  isbn="80-214-2217-3"
}